These ports connect to the microprocessor so that profiling thermocouples can be connected and used with the Profile software to capture, display, print and store profiles. The system includes three thermocouple ports mounted at the oven entrance. ![]() Computer is located on a swing arm at the entrance onload area of the oven. BTU’s Window’s based WINCON software package provides for full temperature, conveyor speed, monitoring and setpoint, profiling and recipe storage. The conveyor continues to operate in this condition.Ĭontrols are located on the RIGHT HAND SIDE as viewed from the oven entrance. In the event of an over temperature condition, power to the heaters is removed and audible/visual alarms sound. This device is redundant protection in addition to the oven zone temperature controllers. Independent, factory set over temperature devices provide protection of zones 1 through 7 in the event of an over temperature condition. Each zone is divided into top and bottom control.Ģ Microprocessor Control Channels ( one top and one bottom ) Zones are controlled by fourteen ( 14 ) PID control loops of the microprocessor control system. (process chamber) 0.8 inches (20.3 mm) below top of pinīelt deviation detection via programmable deviation alarm. Pin to Pin Distance: 0.375 inches (9.5 mm) 5.Cross belt temperature uniformity is within a 40 C delta T in the reflow zone using standard BTU uniformity test board.Ĭonveyor Width:2 inches to 18 inches (5.1cm / 45.7 cm) Each assembly can be easily removed for servicing. ![]() Each zone incorporates 2 Plenum Module Assemblies which house the heaters, blower mechanisms, and control thermocouples. System utilizes BTU style “Porcupine II” heating elements in a BTU Plenum Module. System provides side to side recirculation convection. Working dimensions: 22 inches ( 55.8 cm ) wide belt : 2 inch ( 5.1 cm ) nominal clearance above beltīelt height above floor: 33.0 to 39.0 inches to top of belt ( 83.8 to 99.0 cm ) Number of controlled heated zones: 7 Zones ( 7 top/7 bottom) Nitrogen capable reflow ovens and SMT ovens are typically equipped with an automatic gas sampling system and an Oxygen Analyzer.Lowers maintenance costs, reducing cost-of-ownership The Oxygen levels in a Nitrogen reflow process can be as low as less than 10ppm but may be higher than 500ppm for some less critical processes. The use of Nitrogen or Forming Gas is meant to reduce or eliminate oxidation of the assembly during the heating process. A number of specifications are employed including a maximum and minimum peak temperature inside the reflow soldering oven, such as Flux Activation Time (FAT), Time Above Liquidus (TAL), heating and cooling ramp rates, etc.Ī reflow furnace can process circuit boards in air atmosphere or in a controlled Nitrogen or Forming Gas environment. The recipe is optimized to achieve the profile that the solder reflow machine manufacturer has specified for the solder paste that is used on the board. The temperature that the board “sees” as it is processed through the oven is called “ the profile”. The program with the temperatures for all of the zones, as well as the belt This set point corresponds to the temperature the circuit board should be exposed to as it passes through that zone. During the reflow soldering process, the zones are programmed with a thermal set point. Depending on the length and throughput of the oven there may be few zones, 8 or less, or many zones, 12 or more. Inline reflow ovens are configured with a number of heating zones followed by cooling section(s). ![]() The most modern reflow ovens use closed-loop convection. Convection reflow ovens had many advantages including vast improvements in heating uniformity. Later on, the industry, led by companies like BTU International, switched to convection heat transfer. In the early days of electronics manufacturing, infrared (IR) heating technology was employed. For larger manufacturers, an inline or conveyor belt reflow oven is the best choice. An led reflow furnace can be a small batch (box) style oven for very small lab scale operations. Thermal processing of solder for electronics manufacturing takes place in a reflow oven.
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